Tongfu Microelectronics
Financials
Estimates*
| CNY | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
|---|---|---|---|---|---|---|---|
| Revenues | 10.8b | 15.8b | 21.4b | 22.3b | 25.7b | 30.9b | 35.2b |
| % growth | 30 % | 47 % | 36 % | 4 % | 16 % | 20 % | 14 % |
| EBITDA | 2.2b | 3.3b | 3.9b | 4.4b | 4.4b | 5.5b | 6.0b |
| % EBITDA margin | 20 % | 21 % | 18 % | 20 % | 17 % | 18 % | 17 % |
| Profit | 338m | 957m | 502m | 169m | 952m | 1.4b | 1.8b |
| % profit margin | 3 % | 6 % | 2 % | 1 % | 4 % | 5 % | 5 % |
| EV / revenue | 3.4x | 1.9x | 1.4x | 2.0x | 1.4x | 1.2x | 1.0x |
| EV / EBITDA | 16.5x | 9.4x | 7.7x | 10.2x | 8.5x | 6.5x | 5.6x |
| R&D budget | 744m | 1.1b | 1.3b | 1.2b | - | - | - |
| R&D % of revenue | 7 % | 7 % | 6 % | 5 % | - | - | - |
| Date | Investors | Amount | Round |
|---|---|---|---|
| N/A | N/A | IPO | |
* | N/A | Post IPO Equity | |
* | CNY1.3b | Post IPO Equity | |
* | CNY1.9b | Post IPO Equity | |
* | N/A | Post IPO Equity | |
* | CNY3.2b | Post IPO Equity | |
* | N/A | $370m | Post IPO Equity |
| Total Funding | - | ||
Recent News about Tongfu Microelectronics
EditTFME operates in the semiconductor industry, providing a full range of testing services for integrated circuits (ICs). The company offers wafer probe, strip testing, final testing, and system level testing, catering to clients in high-performance sectors such as CPUs, GPUs, gaming consoles, and networking products. TFME's business model focuses on delivering turnkey solutions that reduce the cost of testing and accelerate time to market for their customers. The company generates revenue through service contracts with semiconductor manufacturers and technology firms. TFME is committed to sustainability, aiming to reduce Scope 1 and Scope 2 greenhouse gas emissions by 25% by 2030.
Keywords: semiconductor testing, wafer probe, strip testing, final testing, system level testing, turnkey solutions, CPUs, GPUs, gaming consoles, networking products, sustainability.